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Your cart is empty. Silicon Wafer Specification
Method: CZ;
Size: 3inch;
Type: N-Type;
Orientation: 111;
Resistivity: 1~10Ω; ;
Thickness: 380um±25;
TTV＜10um ;
Front side: polished;
Backside: etched ;
Package: silicon wafer case ;
*We provide small quantities, special specifications products, and customized services.
*Our products include 1-12 inch silicon wafers (dummy, test, product grade), SiC, GaN, LN & LT and GaAs, InP substrates, etc.
*As a customization service, we can also process silicon wafer oxide film, nitride film, metal film, EPI, custom ultra-thick, ultra-flat, single-sided / double-sided polishing, thinning, dicing service, etc.
$24.22
$ 10 .99 $10.99